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Application examples and design GUIDELINES

When designing components for the semiconductor, solar and electrical industries, it is important to pay attention to the insulating or dissipative properties of the plastics to prevent electrostatic discharges on the one hand, and contamination by electrically conductive abrasion on the other hand. However, contamination can also be caused by an ionic contamination of the materials. In this respect, both the outgassing behavior and the material purity is also an additional selection criterion.

In addition, the dimensional stability of the materials, especially under the influence of temperature, is another important design criterion. Especially in the area of the so-called "Back End Testing" (i.e. carried our for functional testing of electronic components and semiconductors) plastics with low coefficients of thermal expansion for holders, mounts or test socket are required. Dimensional changes due to the influence of temperature can affect the measurement results significantly. Here the very dimensionally stable high-performance plastics based on Torlon® or Vespel® are often used. When manufacturing components for this special area of application, the coefficient of expansion as well as the dimensional changes due to the release of internal stresses must be taken into account. Components made from pressed semi-finished products offer advantages here.

Furthermore, components in the processes of the semiconductor, solar and electrical industries are often exposed to very aggressive environments. Both chemical polishing (CMP) and plasma etching of the silicon wafers require particular corrosion-resistant and wear-resistant materials are required. Due to their excellent chemical resistance, materials such as Techtron® 1000 and Victrex® PEEKTM are used for these processes. Despite their high corrosion resistance, fluoroplastics are usually not used due to their low mechanical strength.

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